Flow Soldering Equipment "PLS series"
There are hardly any copper burrs, and the flow-up is excellent! The soldering device in the inner layer is also reliable.
The "PLS series" is a flow soldering device that performs flow dip soldering in a low oxygen concentration atmosphere. By controlling the posture of the workpiece in conjunction with the posture control of the chamber and conveyor, it is possible to create a stable atmosphere. Additionally, a chamber-type two-stage preheating and coordinated transport are employed for preheating. This allows for uniform heating of large multilayer workpieces while forming the desired preheating temperature profile. 【Features】 ■ The chamber moves to control the posture of the wiring board ■ Well-established low oxygen concentration ■ Excellent heat supply capability and uniform heating (flow dip) ■ CCR preheater ■ Coordinated transport *For more details, please refer to the catalog or feel free to contact us.
- Company:センスビー
- Price:10 million yen-50 million yen